Application of the thermal analysis for detection of the resinoid bond influence on quality of the compositionsVACULIK, L.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 517-519, issn 0368-4466Conference Paper

Kinetic analysis of the process of thermal degradation of poly-N-vinylcarbazole and its derivativesPIELICHOWSKI, K.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 509-511, issn 0368-4466Conference Paper

Thermodynamic stability of phases in the Bi-Sr-Cu-(O) systemNEVRIVA, M; SEDMIDUBSKY, D.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 449-460, issn 0368-4466Conference Paper

Application of thermal analysis for the investigation of polymer degradation processesPIELICHOWSKI, J; PIELICHOWSKI, K.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 505-508, issn 0368-4466Conference Paper

Calorimetry of building materialsTOMAN, J; CERNY, R.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 489-496, issn 0368-4466Conference Paper

Differences in partial thermodynamic functions of some sections of systems Tl-Ag-Te and Tl-Sb-TeZALESKA, E; SZTUBA, Z; FUGLEWICZ, B et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 411-416, issn 0368-4466Conference Paper

Phase equilibria in the system FeVO₄-Fe₂WO₆ in the solid stateWALCZAK, J; RYCHŁOWSKA-HIMMEL, I.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 433-438, issn 0368-4466Conference Paper

Nonequilibrium phase diagrams in the PbCl₂-AgCl eutectic systemCHVOJ, Z; SESTAK, J; FENDRYCH, F et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 439-448, issn 0368-4466Conference Paper

Estimation of average heat capacities of condensed phase transformation products in the Y-Ba-Cu-O systemMOISEEV, G; VATOLIN, N; STEPANEK, B et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 469-476, issn 0368-4466Conference Paper

Novel growth methods of optoelectronic crystals based on antimonidesVENKRBEC, J. J; KOUSAL, J; STETINA, J et al.Journal of thermal analysis. 1995, Vol 43, Num 2, pp 399-410, issn 0368-4466Conference Paper